Photosensitive SILVER PASTE for TSP

Research & Development

R&D Purpose of Photosensitive SILVER PASTE for TSP

  • Photosensitive Ag Paste is a essential material which is used in a process realizing narrow bezel for TSP. The goal is to develop Photosensitive Ag Paste which is possible to realize 20um/20um, 30um/30um Fine Pitch.

Characteristics of product

  • Possible to produce Narrow bezel(20um/20um)
  • Minimizing time to unfreeze products before manufacturing -> can be refrigerated(be kept frozen so far)
  • Lower cost than other companies’
Items Characteristics Remark
Appearance Gray paste -
Metal composition Ag -
Metal contents(wt.%) 78.8% -
Viscosity(Pa.s) 25±2 Pa·s HAAKE Rheostress 1 (25℃, 50rpm)
Thixotropy Index 0.31 log (5/50rpm)
Specific resistance 7.35 * 10-5 Ω·㎝
Adhesion After 60℃ 90%, 168h, 336h 5B -
After TC 5B -
After salt spray test 5B -

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