EMI shielding technology is required to drive electronics reliably by preventing noise from internal interference between electronic devices. The EMI shielding paste can shield individual high-performance semiconductor chips unlike conventional can-type EMI shield which was difficult to reduce volume and weight, can reduce greatly chip-to-chip distances.
Our EMI Shielding Paste which dispersed nano-micro particles uniformly can form evenly thin shielding films of micron scale, exhibits excellent conductivity and stable EMI shielding performance. Especially, it can be applied to various processes by adjusting the properties according to customer's requirement.
| Products | HN-301 | HN-302 | HN-311 | HN-312 | HN-314 |
|---|---|---|---|---|---|
| Volume Resistivity (Ω·㎝) | 9 X 10-5 | 7.5 X 10-5 | 6 X 10-5 | 4 X 10-5 | 9 X 10-5 |
| Thermal Conductivity (W/m∙K) | 1.0 | 1.5 | 2.5 | 2.0 | 2.0 |
| Viscosity (cP) | 4,100 | 3,500 | 7,200 | 2,500 | 20,000 |
| Thixotropic Index (0.5/5) | 2 | 2 | 5 | 9 | 2 |
| Curing Condition | 15min@120 ℃ | 20 min@150 ℃ | 60 min@175 ℃ | 30 min@190 ℃ | 60 min@175 ℃ |
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