Thermally conductive paste is used as an thermal interface material(TIM) that effectively transfers heat generated inside semiconductors or LED devices to outside.
Our thermally conductive paste that treated by our unique nano-surface treatment technology can effectively transfer the heat between the thermally conductive filler, thereby provides excellent heat dissipation performance. In addition, our product that applied silver coated copper as the filler can greatly reduce the cost compared with other products used silver powder. And it is possible to control various properties according to customer's requirement.
| Products | GH-401 | GH-402 | GH-410 | GH-520 |
|---|---|---|---|---|
| Volume Resistivity (Ω·㎝) | 8 X 10-4 | 6 X 10-4 | 3 X 10-4 | 6 X 10-4 |
| Thermal Conductivity (W/m∙K) | 4.0 | 4.0 | 5.0 | 7.0 |
| Viscosity (cP) | 10,000 | 20,000 | 30,000 | 100,000 |
| Thixotropic Index (0.5/5) | 2.5 | 3 | 3 | - |
| Thixotropic Index | 10 min@120 ℃ 3 min@180 ℃ |
20 min@180 ℃ | 20 min@120 ℃ 40 min@180 ℃ |
20 min@120 ℃ 40 min@180 ℃ |
| Adhesion Strength (MPa) | 14 | 58 | 50 | 10 |
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