THERMAL PASTE

Research & Development

R&D Purpose

  • As the electric and lighting industry pursue small size, light weight and high density integration, heating per unit area increases sharply.
  • Lowering power consumption of CPU has reached the limit of current technology.
  • High power LED chip -> Heat dissipation problem become more critical

Characteristics

  • Printing/Dispensing type
  • Realizing both electrical and heat conduction at the same time
  • Realizing low cost by replacing Ag with other metal filler
item Feature
Viscosity 40 ~ 90 kcps
Thixotropic-index 2 ~ 5
Particle Distribution(D50) 2.03 ㎛
Specific Resistance E10-4 ~ E10-5Ω.㎝
Thermal conductivity > 2.6 W/m.K
85℃/85℃% (504hr) resistance change < 10%
Out-Gassing (at curing) < 1%

Application fields

  • Soldering and heat curing simultaneously occur during a reflow
  • TIM for semiconductor(Adhesive)
  • PCB Via hole filling material

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