Solder powder is a main substance of solder paste that is used for soldering PCBs and devices.
We use high quality alloys to manufacture solder powder and minimize the oxidation of powder through a strict quality control. Especially, our products’ particle-size distribution and oxygen density are more outstanding than JEDEC Standard. We can also manufacture ultra-fine powder by request.
Alloy | Melting Point(℃) |
---|---|
Sn/3.0Ag/0.5Cu | 218 ℃ |
Sn/0.3Ag/0.7Cu | 226 ℃ |
Sn/1.0Ag/0.5Cu | 227 ℃ |
Sn/0.7Cu | 227 ℃ |
Type | Under size Content | Size of product | Over size content |
---|---|---|---|
3 | Less than 20 ㎛ Below 5wt% |
20~ 45 ㎛ | Over 45 ㎛ Below 3wt% |
4 | Less than 20 ㎛ Below 5wt% |
20 ~ 38 ㎛ | Over 38 ㎛ Below 1wt% |
5 | Less than 10 ㎛ Below 10wt% |
10 ~ 25 ㎛ | Over 25 ㎛ Below 10wt% |
6 | Less than 5 ㎛ Below 3wt% |
5 ~ 15 ㎛ | Over 15 ㎛ Below 3wt% |
7 | Less than 2 ㎛ Below 2wt% |
2 ~ 11 ㎛ | Over 11 ㎛ Below 2wt% |
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