Solder ball is key part of a semiconductor packaging technology like BGA and CSP. Solder ball is technology-intensive product that transmit electric signals by connecting chips and boards.
DUKSAN Hi-Metal Co., Ltd. provides high-quality products that can realize smaller size, lighter weight and higher function of semiconductors and mobile devices using self-developed unique method.
| Diameter(㎜) | Tolerance(㎜) | Cpk |
|---|---|---|
| 0.762~0.600 | ± 0.025 | ≥ 1.67 |
| 0.599~0.500 | ± 0.020 | ≥ 1.67 |
| 0.499~0.400 | ± 0.015 | ≥ 1.67 |
| 0.399~0.251 | ± 0.010 | ≥ 1.67 |
| 0.250~0.199 | ± 0.003 | ≥ 1.67 |
| 0.099~0.030 | ± 0.003 | ≥ 1.67 |
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