To achieve the goal mentioned above, the R&D Institute of Electronic Materials takes an action based on strategic thinking and encourages members to communicate actively.
Yearly progress of R&D expenditures
| Country | 2002 | 2003 | 2005 | 2006 | 2008 | 2010 | 2011 | 2012 | 2013 | 2014 | Total |
|---|---|---|---|---|---|---|---|---|---|---|---|
| CN | 1 | 1 | 2 | ||||||||
| JP | 2 | 2 | 1 | 1 | 6 | ||||||
| KR | 2 | 1 | 3 | 3 | 4 | 4 | 6 | 8 | 30 | ||
| US | 1 | 1 | 2 | ||||||||
| Total | 2 | 3 | 2 | 6 | 3 | 4 | 4 | 1 | 7 | 8 | 40 |
| Period | Performance | Remark |
|---|---|---|
| 2006.06-2008.05 | Micro solder ball/Fine Solder powder | Commercialized |
| 2008.08-2010.07 | Thermosetting conductive adhesive | - |
| 2009.05-2012.04 | Hybrid underfill material | - |
| 2009.09-2010.08 | Plastic cored solder ball | Tech. transfer |
| 2009.12-2011.10 | Photo sensitive solder paste | - |
| 2010.05-2012.04 | Solder paste for Flip chip bumping | Pilot |
| 2010.09~2012.08 | Series of Low alpha solder alloy | Commercialized |
| 2011.12-2013.11 | Conductive Particle | Commercialized |
| 2012.05-2013.04 | Low alpha cored solder ball | - |
| 2012.05-2014.04 | Flexible transparent electrode film base on based on metal nanowires | - |
| 2012.06~2013.05 | Cored solder ball with improving mechanical shock characteristic | Commercialized |
| 2012.06~ongoing | hybrid adhesive for high heat radiation | - |
| 2013.09~2015.08 | High efficient Ag paste for front electrode of solar cell | Pilot |
| 2014.09~2015.08 | Conductive particle having conductive layer of Ni alloys | Commercialized |
Kor
Eng