As semiconductor chips become small and highly integrated, the manufacturing technology of an alloy with low alpha count
is essential to solve the problem of soft errors occurred in chips.
In the future, Low Alpha alloy will be widely used in more reliable solder joint.
Our company refined impurities like Pb, Bi and etc.
influencing on Alpha Count and developed series of Low Alpha solder alloy including dopant to enhance its performance.
[Principle of soft error occurring]
Alpha Count Grade
Low Alpha ≤ 0.02cph/㎠
Ultra Low Alpha ≤ 0.002cph/㎠
Any solder joint which directly connected to chip(Flip chip Bump, Plating Solution, Solder paste)