Solder ball is a key part of a semiconductor packaging technology like BGA and CSP.
Solder ball is a technology-intensive product that transmit electric signals by connecting chips and boards.
DUKSAN Hi-Metal Co., Ltd. provides high-quality products that can realize smaller size,
lighter weight and higher function of semiconductors and mobile devices using self-developed unique method.
© Copyright 2015 DUKSAN Holdings
Thanks to jQuery Rain